Commerce Department Announces Preliminary Agreement with HP

$50 million in funding would expand an Oregon manufacturing facility.

The Department of Commerce recently announced that it has reached a preliminary manufacturing expansion with HP Inc. The department signed a memorandum of terms proposing $50 million in funding under the CHIPS and Science Act for the company to expand its research and development facilities in Corvallis, Oregon. This facility is currently researching microfluidics and microelectromechanical systems, key technologies aimed at improving the performance and efficiency of semiconductor hardware.

“The Biden-Harris Administration’s proposed investment in HP shows how we are investing in every part of the semiconductor supply chain and how important semiconductor technology is to innovation in drug discovery and critical life science equipment,” said Commerce Secretary Gina Raimondo.“ “The United States will continue leading the world in innovative breakthroughs which all require advanced semiconductor technology while also generating economic opportunity.”

As the Lord Leads, Pray with Us…

  • For Secretary Raimondo to be led by the Lord as she advances manufacturing and production initiatives under the CHIPS and Science Act.
  • For U.S. commerce officials to be discerning as they review and assess the economic support provided by federal agreements with private companies.

Sources: Department of Commerce

RECENT PRAYER UPDATES


Back to top
FE3